Locus Technologies awarded remediation system installation at Union Pacific Railroad Yard in Tracy, CA.

WALNUT CREEK, Calif., 5 May 1999 — Locus Technologies today announced that they were awarded a contract for groundwater remediation system installation at Union Pacific Railroad’s yard in Tracy, CA.

The remediation project will be managed in four phases: (1) construction of the infiltration trench, (2) construction of the extraction wells, (3) installation of the treatment system, and (4) system automation. As a leader in the field of groundwater treatment and automation, Locus will apply the most advanced techniques for installation of mechanical, electrical, instrumentation, and control systems.

Locus Technologies is thrilled to have the opportunity to install an advanced automated groundwater treatment system at UPRR’s Tracy Yard. This is the third in a series of UPRR groundwater treatment system automation projects awarded to Locus Technologies in recent months. “It clearly demonstrates that Locus’s state-of-the-art Internet-based automation technology, when coupled with system installation, provides significant reduction of the overall cost for groundwater remediation projects. We are pleased that we can transfer those savings to UPRR,” said Mr. Neno Duplancic, President of Locus Technologies.

Digital Signal Processing Of Data From Borehole Creep Closure

ABSTRACT: Digital signal processing, a technique commonly used in the fields of electrical engineering and communication technology, has been successfully used to analyze creep closure data obtained from a 0.91 m diameter by 5.13 m deep borehole in bedded salt. By filtering the “noise” component of the closure data from a test borehole, important data trends were made more evident and average creep closure rates were able to be calculated. This process provided accurate estimates of closure rates that will be used in the design of lined boreholes in which heat-generating transuranic nuclear wastes will be emplaced at the Waste Isolation Pilot Plant.

Authors: S. Chakrabarti (International Technology Corporation) | N. Duplancic (International Technology Corporation) | W.C. Patrick (International Technology Corporation)